About Micro-bump riding in the grid
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About Micro-bump riding in the grid video introduction
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6 FAQs about [Micro-bump riding in the grid]
What is a micro bump pillar?
As for the interconnection technology with bump pitch between 40 to 130μm, which is so-called micro bump or chip connection (C2) bumps, the thermal-mechanical warpage and bonding precision are the major challenges. The copper pillar with thinner solder tip is generally produced to meet the finer pitch requirements.
What is a micro bump array?
Micro bump arrays built on the organic substrates including the thin flexible film substrates have been recognized as valuable constructions for the high-density packaging terminations. The solder ball grid array has become a popular technology as the common construction for electronic packaging.
How many microbumps does a 3D stacked DRAM have?
This state of the art 3D-stacked DRAM uses TSV technology and has grid array of 4942 microbumps at 55um pitch as its signal terminal. Until now, there was no proper solution for bump probing such a fine pitch and high density as well in the market. Each die 30 μbumps are inspected.
Why are micro bumps built through the base film?
The micro bumps are built through the base film. This construction makes the mechanical reliability of the micro bumps higher. The construction provides more functions for the backside of the flexible circuits to reduce the size of the semiconductor packaging.
How to create access holes for micro bump arrays?
Conventional solder mask and overlay materials are available to generate the access holes for the micro bump arrays. But conventional screen-printing and pre-punching of the films are not suitable to generate holes finer than 500 micron diameter. The photo imaging processes are capable of producing holes smaller than 100 micron diameter.
Can micro bump arrays be used for non-permanent connections?
A series of electrical plating processes to build various kinds of micro bump arrays on the organic substrates has been developed for non-permanent connections. Copper bump arrays with nickel/hard gold plating on the organic substrate with small pitches have been required for the non-permanent terminations.